Four dedicated fabs. One connected system.

NantOptiFab designs, fabricates, packages, and tests photonic integrated circuits through specialized California facilities spanning lithium niobate, nonlinear photonics, silicon nitride, and silicon photonics.

4Dedicated optical wafer fabs
107,600+Square feet of fab space
20,000+Wafers per month
11White and yellow-light modules

Specialized around the material

Each fab concentrates the processes and equipment needed by its platform while sharing design, backend, packaging, metrology, and quality infrastructure across the full manufacturing system.

01 / HIGH-SPEED EO

LN & TFLN Fab

3,000+

wafers per month

High-speed electro-optic modulators, coherent devices, and ultra-broadband transceivers.

02 / NONLINEAR

ELN™ & PPLN Fab

3,000+

wafers per month

Enhanced electro-optics, wavelength converters, and quantum photon sources.

03 / LOW LOSS

Silicon Nitride Fab

10,000+

wafers per month

Ultra-low-loss devices, passive routing, and wafer-level photonic interposers.

04 / HIGH DENSITY

Silicon Photonics Fab

5,000+

wafers per month

800G/1.6T CPO modules, integrated Tx/Rx, and AI-interconnect PICs.

Combined capacity exceeds 20,000 wafers per month across the four dedicated California fabs.

White light and yellow light, connected

Wafer preparation, film formation, integration, backend, packaging, patterning, metallization, and PPLN domain engineering are arranged as one coordinated workflow.

Automated white-light wafer processing equipment

White light area

Wafer processing

Wafer preparation, PECVD, LPCVD, sputtering, bonding, CMP, implantation, integration, packaging, and metrology across six process modules.

Yellow-light lithography and patterning area

Yellow light area

Patterning & poling

Coating, exposure, development, stepper and e-beam patterning, ICP-RIE, IBE, lift-off, metallization, high-voltage poling, PFM, and SHG verification across five modules.

White light · 6 process modules

Wafer prep
Wet bench · Megasonic · SRD
Deposition
PECVD · LPCVD · Sputter
Thermal
Tube furnace · RTA · Vacuum furnace
Integration
Wafer bonder · CMP · Ion implanter
Dicing / packaging
Dicing saw · Laser dicer · Facet polisher
Metrology
SEM · AFM · Optical loss

Yellow light · 5 process modules

Coat / develop
Spin coater · Hot plate · Developer
Lithography
Mask aligner · Stepper · E-beam
Etching
ICP-RIE · IBE · RIE
Metal process
E-beam evaporator · Lift-off · Sputter
PPLN
High-voltage poling · PFM · SHG

Automation in action

Automated equipment connects critical steps into one repeatable wafer workflow, increasing controlled throughput and process consistency across material platforms.

01

Load & transfer

Controlled wafer movement into the qualified process sequence.

02

Recipe-driven process

Automated execution using defined platform and device recipes.

03

Wafer inspection

Integrated optical and process verification at critical control points.

04

Stable output

Consistent execution, traceability, and repeatable manufacturing.

05

Quality assurance

Final metrology, optical test, electrical test, and delivery review.

Automated wafer handling, processing, and inspection cycle
Automated wafer patterning tool in the yellow-light area
Automated patterning in the yellow-light area.

Built for repeatable scale

Dedicated platform capacity is paired with common analytical, packaging, and quality infrastructure so programs can move from development through repeatable production without changing partners.

Production systemPlatform roleRepresentative outputMonthly capacity
LN / TFLNElectro-optic modulationModulators and broadband transceivers3,000+
ELN™ / PPLNEnhanced EO and nonlinear opticsCoherent devices and photon sources3,000+
SiNUltra-low-loss passive photonicsInterposers, filters, and quantum circuits10,000+
SiPhDense electronic–photonic integrationCPO modules and AI interconnect PICs5,000+

100% USA supply-chain positioning

NantOptiFab is a California-based photonics company building American multi-platform photonic manufacturing, from material platforms through packaged modules.

American operations

California foundation

Engineering, manufacturing, packaging, and customer engagement are centered in California and the United States.

Vertical integration

Fewer handoffs

Materials, process development, device design, wafer fabrication, backend, packaging, and test are coordinated under one manufacturing organization.

Ecosystem

Built for partners

Fabless PIC designers, system integrators, universities, and downstream product teams can engage at the stage that matches their program.